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Electronics Electroplating System

times: 2013-08-08 author:admin

Application: Gold, nickel, tin, copper and silver plating, aluminum-oxidation, phosphatation, electrolytic polishing, chemical nickel-plating and other chemical treatment for processes such as gold plating of pin on electronic components, Ni-Au plating on electronic packaging, aluminum substrate chromating, anodizing etc.

Features: Highly efficient, energy saving, clean, safe and reliable.

Description of Production Lines:
Control System:Manual, semi-automatic, or fully automatic;
Plating Rack:Barrel plating or rack plating;
Traveling Crane:Sidearm, gantry crane and suspended type
Manual Plating System
Barrel Plating System for Electronic Components
Rinsing and Plating Table for Semiconductors
Roller Plating Unit

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